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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com tsz02201-0h1h0b101290-1-2 jun.19.2015 rev.001 dc brushless fan motor drivers multifunction single-phase full-wave fan motor driver BD61243FV general description BD61243FV is a 1chip driver that is composed of h-bridg e power dmos fet. moreover, the circuit configuration is restructured, and convenience has been improved by reducing the external pa rts and simplifying the setting compared with the conventional driver. features ? ssop small package ? driver including power dmos fet ? speed controllable by dc / pwm input ? i/o duty slope adjust ? pwm soft switching ? current limit ? start duty assist ? lock protection and automatic restart ? quick start ? rotation speed pulse signal (fg) output key specifications ? operating voltage range: 5.5v to 16v ? operating temperature range: C 40 c to + 10 5c ? output voltage(total): 0.2v(typ) at 0.2a package w (typ) x d (typ) x h (max) 5.00mm x 6.40mm x 1.35mm applications ? f an motors for general consumer equipment of desktop pc, projector, e tc. typical application circuits ssop- b1 4 figure 1. application of direct pwm input pwm m h slope rnf h+ h- out1 re f min ssw v cc zp er out2 sig fg 1 gnd pwm 2 3 13 12 11 10 4 5 6 7 9 8 14 figure 2. application of dc voltage i nput dc m h slope rnf h+ h- out1 ref min ssw v cc z per out2 sig fg 1 gnd pwm 2 3 13 12 11 10 4 5 6 7 9 8 14 datashee t downloaded from: http:///
. 2/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 pin configuration pin description i/o truth table hall input driver output h+ h C out1 out2 fg h l l h hi -z l h h l l h; high, l; low, hi-z; high impedance fg output is open-drain type. block diagram p/no. t/name function 1 fg speed pulse signal output terminal 2 h C hall C input terminal 3 h+ hall + input terminal 4 slope i/o duty slope setting terminal 5 pwm pwm input duty terminal 6 out2 motor output terminal 2 7 rnf output current detecting resistor connecting terminal (motor ground) 8 out1 motor output terminal 1 9 v cc power supply terminal 10 ref reference voltage output terminal 11 min minimum output duty setting terminal 12 z per re -circulate period setting terminal 13 s sw soft switching setting terminal 14 gnd ground terminal (signal ground) pwm slope rnf h+ h- out1 ref min ssw tsd control logic osc filter v cc refe- rence pre- driver zper out2 inside reg 13 12 11 10 2 3 4 5 6 7 9 8 fg signal output 1 gnd 14 + - comp zper ref h+ rnf slope h- fg out1 v cc s sw pwm gnd min 1 2 3 4 5 6 7 13 out2 14 12 11 10 9 8 (top view) downloaded from: http:///
. 3/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 absolute maximum ratings parameter symbol rating u nit supply voltage v cc 18 v power dissipation pd 0.87 (note 1) w operating temperature range topr C 40 to + 10 5 c storage temperature range tstg C 55 to +150 c output voltage v omax 18 v output current i omax 1.2 (note 2) a rotation speed pulse signal (fg) output voltage v fg 18 v rotation speed pulse signal (fg) output current i fg 10 ma reference voltage (ref) output current i ref 10 ma input voltage1 (h+, h C ,min,ssw,zper ,s lope) v in1 4 v input voltage2 (pwm) v in2 6.5 v junction temperature tj 150 c (note 1 ) derate by 7.0mw/c when operating over ta=25c. (mounted on 70 .0mm70.0mm1.6mm glass epoxy board) (note 2) do not exceed pd and tj=150c. caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min typ m ax u nit operating supply voltage range v cc 5.5 12 16 v input voltage range1 (h+, h C , min , ssw, zper, sl ope) v in1 0 - v ref +0.3 v input voltage range2 (pwm) v in2 -0.3 - 5 v pwm input duty range d pwm 0 - 100 % pwm input frequency range f pwm 15 - 50 khz downloaded from: http:///
. 4/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 electrical characteristics (unless otherwise specified ta=25c, v cc =12v) parameter symbol limit u nit conditions characteristic data m in t yp m ax circuit current i cc 3.0 4 .5 6.5 ma figure 3 output voltage v o - 0.2 0.35 v i o =2 00 ma , high and low side total figure 4 to figure 7 lock detection on time t on 0.3 0.5 0.7 s figure 8 lock detection off time t off 3.0 5.0 7.0 s figure 9 lock detection off/on ratio r lck 8.5 10.0 11.5 - r lck =t off / t on figure 10 fg hysteresis voltage+ v hys+ 7 12 17 mv figure 11 fg hysteresis voltage- v hys- -5 - 10 - 15 mv fg output l ow voltage v f gl - - 0.30 v i fg =5ma figure 12 to figure 13 fg output leak current i fgl - - 10 a v fg =16v figure 14 pwm input high level voltage v pwmh 2.5 - 5.0 v - pwm input l ow level voltage v pwml 0.0 - 1.0 v - pwm input current i pwmh -10 0 10 a v pwm =5v figure 15 to figure 16 i pwml - 50 - 25 - 12 a v pwm =0v reference voltage v ref 3.0 3.3 3. 6 v i ref =-1ma figure 17 to figure 18 current limit setting voltage v cl 235 265 295 mv figure 19 for parameters involving current, positive notation means inflow of current to ic while negative notation means outflow of current from ic. downloaded from: http:///
. 5/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 typical performance curves (reference data) -1.2 -0.9 -0.6 -0.3 0.0 0.0 0.4 0.8 1.2 output source current: i o [a] output high voltage: v oh [v] 0.0 0.3 0.6 0.9 1.2 0.0 0.4 0.8 1.2 output sink current: i o [a] output low voltage: v ol [v] figure 4. output high voltage vs output source current (v cc =12v) figure 3. circuit current vs supply voltage figure 6. output low voltage vs output sink current (v cc =12v) 10 5c 25 c C 40 c 0 2 4 6 8 0 5 10 15 20 supply voltage: v cc [v] circuit current: i cc [ma] 10 5c 25 c C 40 c operating voltage range 10 5c 25 c C 40 c figure 5. output high voltage vs output source current -1.2 -0.9 -0.6 -0.3 0.0 0.0 0.4 0.8 1.2 output source current: i o [v] output high voltage: v oh [v] 16v 12v 5.5v downloaded from: http:///
. 6/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 typical performance curves (reference data) C continued 0.0 0.3 0.6 0.9 1.2 0.0 0.4 0.8 1.2 output sink current: io[a] output low voltage: v ol [v] 0.3 0.4 0.5 0.6 0.7 0 5 10 15 20 supply voltage: vcc[v] lock detection on time: t on[s] 8.0 9.0 10.0 11.0 12.0 0 5 10 15 20 supply voltage: vcc[v] lock detection off/on ratio: r lck [s/s] 16v 12v 5.5v figure 7. output low voltage vs output sink current (ta=25 c ) figure 8. lock detection on time vs supply voltage figure 9. lock detection off time vs supply voltage 105 25 - 40 3.0 4.0 5.0 6.0 7.0 0 5 10 15 20 supply voltage: vcc[v] lock detection off time: t off [s] 10 5c 25 c C 40 c 10 5c 25 c C 40 c operating voltage range operating voltage range operating voltage range figure 10. lock detection off/on ratio vs supply voltage downloaded from: http:///
. 7/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 typical performance curves (reference data) C continued 0.0 0.2 0.4 0.6 0.8 0 2 4 6 8 10 fg sink current: i fg [ma] fg output low voltage: v fgl [v] 0.0 0.2 0.4 0.6 0.8 0 2 4 6 8 10 fg sink current: i fg [ma] fg output low voltage: v fgl [v] 10 5c 25 c C 40 c figure 13. fg output voltage vs fg sink current (ta=25 c ) 16v 12v 5 .5 v figure 14. fg output leak current vs fg voltage figure 11. fg hysteresis voltage vs supply voltage -2 0 2 4 6 8 0 5 10 15 20 fg voltage: v fg [v] fg output leak current: i fgl [ua] 10 5c 25 c C 40 c -40 -20 0 20 40 0 5 10 15 20 supply voltage: vcc[v] fg hysteresis voltage: v hys [mv] 10 5c 25 c C 40 c 10 5c 25 c C 40 c operating voltage range operating voltage range figure 12. fg output low voltage vs fg sink current (v cc =12v) downloaded from: http:///
. 8/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 typical performance curves (reference data) C continued -50 -40 -30 -20 -10 0 0 5 10 15 20 supply voltage: v cc [v] pwm intput low current: i pwml [ua] -2 0 2 4 6 8 0 5 10 15 20 supply voltage: v cc [v] pwm intput hi current: i pwmh [ua] figure 15. pwm input hi current vs supply voltage 10 5c 25 c C 40 c 10 5c 25 c C 40 c operating voltage range operating voltage range figure 16. pwm input low current vs supply voltage 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 supply voltage: v cc [v] reference voltage: v ref [v] 10 5c 25 c C 40 c figure 17. reference voltage vs supply voltage (i ref =-1ma) 2.0 2.5 3.0 3.5 4.0 0.0 2.5 5.0 7.5 10.0 ref source current: i ref [ma] refarence voltage: v ref [v] figure 18. reference voltage vs ref source current (ta=25 c ) 16v 12v 5 .5 v operating voltage range downloaded from: http:///
. 9/27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 typical performance curves (reference data) C continued 200 250 300 350 400 0 5 10 15 20 supply voltage: v cc [v] current limit setting voltage: v cl [mv] 10 5c 25 c C 40 c figure 19. current limit setting voltage vs supply voltage operating voltage range downloaded from: http:///
. 10 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 application circuit examples (constant values are for reference) 1. pwm input application it is an example of the application of the external pwm in put, and controlling the rotational speed. in this appli cation , minimum rotational speed can be set. application design note (1) the bypass capacitor connect ed must be more than the recommended constant value becau se there is a possibility of the motor start-up failure etc. due to ic malfunctio n. substrate design note (1) ic power(vcc), motor power(vm), motor outputs(out1, 2), and motor groun d(mgnd) lines are made as wide as possible. (2 ) ic ground (gnd) line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to ( C ) land. (3) the bypass capacitor and/or zenner diode are placed ne ar to v cc pin. (4 ) h+ and h C lines are arranged side by side and made from the hall ele ment to ic as short as possible, because it is easy for the noise to influence the hall lines. figure 20. pwm input application reverse polarity protection measure against back emf pwm m h sig to 1k 0.22 to 1 f to 1k to 100k 1k to 1 00 k pwm slope rnf h+ h- out1 ref min ssw tsd control logic osc filter v cc refe- rence p re - driver zper out2 inside reg 13 12 11 10 2 3 4 5 6 7 9 8 fg signal output 1 gnd 14 + - comp maximum output voltage and current are 18 v and 1.2a respectively connect bypass capacitor near vcc terminal as much as possible. soft switching setting minimum duty setting stabilization of ref voltage re-circulate setting hall bias is set according to the amplitude of hall element output and hall input voltage range. protection of fg open-drain to limit motor current, the current is detected. note the power consumption of sense resistance. noise measures of substrate low-pass filter for rotation speed instruction input i/o duty slope setting linearization correction resistance downloaded from: http:///
. 11 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 application circuit examples (constant values are for reference) C continued 2. dc voltage input application th is is an example application circuit for the rotation speed control by dc voltage. in this application, mini mum rotational speed cannot be set. figure 21. dc voltage input application pull-down pwm terminal to in gnd zener diode for min withstand voltage protection dc pwm slope rnf h+ h- out1 ref min ssw ts d control logic osc filter v cc refe- rence pre- driver zper out2 inside reg 13 12 11 10 2 3 4 5 6 7 9 8 fg signal output 1 gnd 14 + - comp m h sig to 1k 0.22 to 1 f to 1k to 100k 1k to 1 00 k 0 downloaded from: http:///
. 12 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 functional descriptions 1. variable s peed operation the rotational speed of the motor changes by the pwm du ty of the motor outputs (out1 and out2 terminals). however, it provides for the motor's output not by the rotational speed but by the duty in the bd6 124 3fv, because the rotational speed is not uniquely decided by the motor output duty . the changeable speed operation is controlled by these two inpu t terminals. (1) pwm operation by pulse i nput in pwm terminal (2) pwm operation by dc input in min terminal (note) pwm frequency of output is 50khz (typ). hence, input pwm frequ ency is not equal to pwm frequency of output. (1) pwm operation by pulse input in pwm terminal the pwm signal from the controller can be input directly to ic in figure 22 . the output duty is controlled by the input pwm duty (figure 23 ). refer to recommended operating conditions (p.3) and ele ctrical characteristics (p.4) for the input condition. internal power-supply voltage (internal reg; typ 5.0v) is impressed when the pwm terminal is open, it becomes 100% input of the duty and equivalent, and a fu ll torque is driven. there must be a pull- down resista nce outside of ic to make it to torque 0 when the pwm terminal opens (however, only at the controller of the complimentary output type.). insert the protective resistance a nd capacitor for noise remova l if necessary. full torque (v pwm >2.5v) and zero torque(<1.0v) can recognize the dc voltage inpu t of the pwm terminal. however, the variable speed control in the dc voltage between 0v and 5.0 v should be not able to be done. (a) setting of minimum output duty (min) minimum rotational speed can be set by min terminal in fi gure 24 . the resolution of the min terminal is 128 steps. min terminal should be short ed to gnd when this function is not used. figure 22. pwm input application min ref setting voltage division of resistance (min enable) ok min ref setting of resistance pull-down (min disable) ok figure 26 . min terminal setting min ref ng open setting (prohibit input) pwm input on duty [%] out1, 2 outputs on duty [%] 100 100 0 a min setting 0. 1 0 ref 5 minimum output duty setting (128 steps) 100 min input voltage [v] output minimum duty [%] 1 30 pwm protection resistor motor unit driver pwm filter internal reg controller pull-down resistor complimen -tary output capacitor for noise removal min ref setting of resistance pull- up (full torque) ok figure 23. pwm input operation timing chart inside re g out1 pwm 5.0v 1.0v 2.5v out2 low high low high low high h+ h C 0.0v gnd zero full motor torque : high impedance motor output on figure 24 . setting of minimum output duty figure 25 . relation of m in input voltage and output duty downloaded from: http:///
. 13 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 function al descriptions C continued (b) setting of slope of i/o duty (slope) slope of output duty and the input duty to pwm terminal can be e stablished by slope setting in figure 27. the resolution of min is 128 steps. but if the voltage of the slope terminal is 0.4v to 0 .825v (typ),then the slope of the input and output duty is fixed to 0.5, and if it is le ss than 0.4v (typ) the slope is fixed to 1 (figure 28 ) . slope terminal should be short ed to gnd, when this function is not used. when you perform the minimum rotation speed setting while m aking slope setting, please decide min voltage based on a lower expression. min voltage = 3.3 x {(target minimum duty - 100 + 100 x slope) / ( 100 x slope )} ? ? ? equation 1 (e x.) in the case of slope=1 and target minimum duty=20%, calcul ate the slope and min voltage in the following. the slope voltage sets with slope=0v from figure 28. the min voltage from equation 1; min = 3.3 x {( 20 C 100 + 100 x 1 ) / ( 100 x 1)} = 0.66[v] (e x.) in the case of slope=0.75 and target minimum duty=40%, ca lculate the slope and min voltage in the following. the slope voltage sets with slope=1.24v from figure 28. the min voltage from equation 1; min = 3.3 x {( 40 C 100 + 100 x 0.75 ) / ( 100 x 0.75)} = 0.66[v] (e x.) in the case of slope=1.75 and target minimum duty=30%, cal culate the slope and min voltage in the following. the slope voltage sets with slope=2.9v from figure 28. the min voltage from equation 1; min = 3.3 x {( 30 C 100 + 100 x 1.75 ) / ( 100 x 1.75)} = 1.98[v] figure 27 . adjust of slope of i/o duty pwm input on duty [%] out1, 2 outputs on duty [%] 100 100 0 a slope setting slope=2 slope=0.5 0. 8 25 0 ref 0.5 i/o duty slope setting (128 steps) 2 slope input voltage [v] slope 1 1 .5 1 .6 5 2. 5 0. 4 figure 28 . relation of slope voltage and slope of i/o duty slope ref setting voltage division of resistance (slope enable) ok slope ref setting of resistance pull-down (slope = 1) ok slope ref ng open setting (prohibit input) figure 29 . slope terminal setting slope ref setting of resistance pull- up (slope=2) ok downloaded from: http:///
. 14 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 (2) pwm operation by dc input in min terminal the output duty can be vari ed by inputting dc voltage into min terminal. pwm terminal sho uld be shorted to gnd when this function is used. pl ease refer to input voltage range 1(p.3) for the input cond ition of the min terminal. min terminal voltage becomes unsettled when min terminal is in an open state. the voltage of the terminal becomes irregular if min terminal is open. input voltages to min terminals when you turn on ic power supply (v cc ) in figure 30 . (note)in the case of dc voltage input, it cannot set the lowest output duty. (a) setting of slope of i/o duty (slope) slope of output duty and the input voltage to min terminal can be established by slope setting in figure 32 . th e resolution of slope is 128 steps. but if the voltage of the slope terminal is 0.4v to 0.825v (typ), then the slope of the input and output duty is fixed to 0.5, and if it is less than 0.4v (typ) the slope is fixed to 1 (figure 28) . slope terminal should be short ed to gnd, when this function is not used. re f min 3.3v 0% 100% low high h+ h C 0.0v gnd zero full m ot or t or qu e out2 duty out1 low : high impedance m ot or ou tp u t on high figure 30 . dc input application figure 31 . dc input operation timing chart figure 32 . relation of m in input voltage and slope of i/o duty min [v] out1, 2 outputs on duty [%] 3.3 100 0 a slopesetting slope=2 slope=0.5 min pwm filter in ternal reg dc 200k (typ) zener diode for min withstand voltage protection downloaded from: http:///
. 15 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 functional descriptions C continued 2. about setting of phase switching of output the period of soft switching and re-circulate can be adjusted by ssw and zper setting. (1 ) soft switching period setting (ssw) the soft switching section in the output can be set by ss w terminal. by adjusting ssw voltage, soft switching section can be set from 22.5 to 90 as one period of hal l signal 360 . the resolution of ssw is 128 steps in figure 34 . timing chart is shown in figure 33 . (note)a soft switching period is the section where on duty of the output chan ges from a target duty into 0% by 16 steps. h+ h C low high low high motor cu rrent 0a out1 out2 adjust a soft switching period by ssw setting setable range m in 22.5 to m ax90 one period of hall signal 360 soft switching period (max 90 ) figure 33 . soft switching period setting 0. 8 25 0 ref 22.5 set of soft switching period (128 steps) 90 s sw input voltage [v] 45 67.5 1 .6 5 2. 5 angle[] figure 34 . relation of ssw input voltage and soft switching period s sw ref setting voltage division of resistance ( ssw enable) ok s sw ref setting of resistance pull-down ( ssw min 22.5) ok figure 35 . s sw terminal setting s sw ref ng open setting (prohibit input) s sw ref setting of resistance pull- up (s sw m ax 90 ) ok downloaded from: http:///
. 16 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 function al descriptions C continued (2) re -circulate period setting (z per ) the recirculate period in fall of the output can be set by zper terminal. by adjusting zper voltage, recirculate period can be set from 0 to 90 as one period of hall si gnal 360 in figur e 37 . the resolution of zper is 128 steps. timing chart is shown in figure 36 . about priority of ssw and zper setting, the setting priority of the p eriod to regenerate than a soft switching period is high. for example, v ssw =1.65v, v zper = 0 .825v soft switching period = (1.65 / 3.3) x 90 - (0.825 / 3.3) x 90 = 45 - 22.5 = 22.5 re-circulate period = (0.825 / 3.3) x 90 = 22.5 when you set a period to regenerate for longer than soft switching period, a soft switching section for 5.6 (typ) enters. * a recirculate period is a current recirculate period before phas e switching of output. in the recirculate period, the logic of the output transistor is d ecided by the hall input logic. the phase of output hi becomes the high impedance, and the ph ase of output l ow is l ow . figure 36. re -circulate period setting 0. 8 25 0 ref 22.5 set of re -circulate period (128 steps) 90 z per input voltage [v] 45 67.5 1 .6 5 2. 475 angle[] figure 37 . relation of zper input voltage and re -circulate period h+ h C low high low high motor current 0a out1 out2 adjust a re -circulate period by zper setting setable range m in 22.5 to m ax90 one period of hall signal 360 soft switching period re -circulate period(max 90 ) figure 38 . zper terminal setting zper ref setting voltage division of resistance (zper enable) ok zper ref setting of resistance pull-down (zper min 0) ok zper ref ng open setting (prohibit input) zper ref setting of resistance pull- up (zper m ax 85 ) ok downloaded from: http:///
. 17 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 functional descriptions C continued (3 ) kickback restraint function (lead angle correction) automatically detects a current phase gap, and an aspect chang e point is revised to lead angle. when a current phase is delayed for a hall phase, output pha se can be changed up to 22.5 automatically. timing chart is shown in figure 39 and 40 . a kickback restraint function is a miscellaneous function to prevent leaping up of the output voltage to occur at the time of power-on and a torque sudden change. based on a setting method of ssw and zper of figure 4 1, prevent this function from working in normal operation. h+ h C low high low high ` 0a out1 out2 set of soft switching period; 40 lead angle none kickback restraint ; none set of re-circulate period; 0 one period of hall signal 360 set of soft switching period; 40 kickback restraint; available set of re-circulate period; 0 one period of hall signal 360 lead angle max 22.5 figure 39 . normal operation figure 40 . kickback restraint operation operate a motor by maximum power supply voltage thought about under conditions of ssw=2.7v, zper=0v timing of the phase change; out1 and out2 = f g? silent performance; is it enough? rotation speed; is it enough? completion of ssw and zper setting ssw voltage up and/or zper voltage up ssw voltage up and/ or zper voltage down ssw voltage down and/ or zper voltage down yes yes yes no no no figure 41. flow of setting of ssw and zper terminal downloaded from: http:///
. 18 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 functional descriptions C continu ed 3. current limit the current limit circuit turns off the output, when the curren t that flows to the motor coil is detected exceeding a set value. the current value that current limit operates is determi ned by internal setting voltage and current sense resistor. in figure 42, i o is the current flowed to the motor coil, r nf is the resistance detecting the current, and p rmax is the power 4. lock protection and automatic restart motor rotation is detected by hall signal, and the ic internal counter set lock detection on time (t on ) and off time (t off ). timing chart is shown in figure 43. t off (typ 5.0s) low high : high impedance out1 low high low high h+ h C 0% motor output on duty out2 fg low high t on (t yp 0.5s) t on t off motor lock lock detection motor lock release motor idling t on t off instruction torque current limit comp gnd motor ground line r nf ic signal ground line v cl out1 out2 rnf i o m figure 43 . lock protection (incorporated counter system) timing chart i o [a] = v cl [v] / r nf [ ] = 265[mv] / 0. 33 [ ] = 0.803[a] figure 42 . setting of current limit and grout lines p rmax [w] = v cl [v] x i o [a] = 265[mv] x 0. 803 [a] = 0.213[w] downloaded from: http:///
. 19 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 functional descriptions C continued 5. quick start when torque off logic is input by the control signal over a fixed time, the lock protection function is disabled. the motor can restart quickly once the control signal is applied. 6. start duty assist start duty assist can secure a constant starting torque even a t low duty. the ic is driven by a constant output duty (d ohl ; typ 50 %) within detection of motor rotation. when output on duty is le ss than 50% (typ) , start duty assist function operates under the following condition s: (1 ) power on (2 ) lock release (3 ) quick start (4 ) thermal shut down(tsd) relea se figure 44 . quick start timing chart (pwm input application) disable enable pwm low high low high h+ h C 0% under 5 ms (typ) torque o ff motor stop torque on lock protection signal motor idling pwm or min torque motor output on duty quick start standby mode off on 0% pwm or min torque motor output on duty duty assist power on :start duty assist p ohl (t yp 50%) power detect of motor rotation 100% figure 46 . timing chart of power on 150 c 175 c 0% duty assist tsd on t ohl (typ 0.5 s) d ohl (typ 50%) off motor output on duty junction temperatur e :start duty assist 100% pwm or min torque figure 47 . timing chart of ts d release figure 45. i/o duty characteristic in start duty assist motor output on duty[%] 100 0 50 100 pwm duty [% ] p oh 50 d ohl ; typ 50% downloaded from: http:///
. 20 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 functional descriptions C continued 7. hall input setting hall input voltage range is shown in operating conditions (p.3). adjust the value of hall element bias resistor r 1 ,r 2 in figure 49 so that the input voltage of a hall amplifier is input in "input voltage range 1"( p. 3) including signal amplitude. r 2 is resistance to correct the temperature characteristic of the hal l element. (1) reducing the noise of hall signal vcc noise or the like depending on the wiring pattern of b oard may affect hall element. in this case, place a capacitor like c 1 in figure 49. in addition, when wiring from the hall elemen t output to ic hall input is long, noise may be induced on wiring. in this case, place a capacitor lik e c 2 . 8. high-speed detection protection high-speed detection protection begin lock protection acti on w hen it detects that the hall input signal is in an abnormal state (more than typ 2.5khz). noise may be induced on wiring. in th is case, place a capacitor like c 2 in figure 49. ref h+ hall c 1 c 2 r 2 r 1 r h v h i h hall bias current; i h [a] = v ref [v] / (r 1 +r 2 //r h )[ ] hall bias voltage; v h [v] = v ref [v] x (r 2 //r h ) / (r 1 +r 2 //r h )[ ] refe- rence h C comp - + figure 49 . hall input application 0v hall input upper limit h+ h C operating hall input voltage range hall input lower limit h+ h C v ref +0.3v figure 48 . hall input voltage range downloaded from: http:///
. 21 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 safety measure 1. reverse connection protection diode reverse connection of power results in ic destruction as shown in figure 50 . when reverse connection is possible, reverse connection protection diode must be added between pow er supply and v cc . 2. protection against v cc voltage rise by back electromotive force back electromotive force (back emf) generates regenerative curren t to power supply. however, when reverse connection protection diode is connected, v cc voltage rises because the diode prevents current flow to po wer supply. when the absolute maximum rated voltage may be exceede d due to voltage rise by back electromotive force, place (a) capacitor or (b) zener diode between v cc and gnd. if necessary, add both (c). 3. problem of gnd line pwm switching do not perform pwm switching of gnd line because gnd terminal potential c annot be kept to a minimum. 4. protection of rotation speed pulse (fg) o pen -drain output fg output is an open drain and requires pull-up resistor. a dding resistor can protect the ic. exceeding the absolute maximum rating, when fg terminal is directly connected to power su pply, could damage the ic. figure 50 . flow of current when power is connected reversely fi gure 51. v cc voltage rise by back electromotive force fi gure 52. measure against v cc and motor driving outputs voltage figure 53. gnd line pwm switching prohibited figure 54. protection of fg terminal i/o vcc gnd in normal energization internal circuit impedance is high ? amperage small circuit block i/o gnd reverse power connection large current flows ? thermal destruction circuit block vcc i/o gnd after reverse connection destruction prevention no destruction circuit block vcc on phase switching on on on on on on on on on (a) capacitor (b) zenner diode (c) capacitor & zenner diode vcc gnd prohibit motor driver controller pwm input m fg driver protection resistor motor unit pull- up resistor sig connector downloaded from: http:///
. 22 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 power consumption 1. current pathway the current pathways that relates to driver ic are the following, and shown in figure 55. (1 ) circuit current (i cc ) (2 ) motor current (i m ) (3 ) reference bias current to the resistors (i ref ) (4 ) fg output sink current (i fg ) 2. calculation of power consumption (1 ) circuit current (i cc ) p w1 [w] = v cc [v] x i cc [a] (icc current doesnt include i m , i ref ) (ex.) vcc = 11.3[v], icc = 4. 5[ma] p w1 [w] = 11.3[v] x 4. 5[ma] = 50.85 [m w] (2 ) motor driving current (i m ) v oh is the output saturation voltage of out1 or out2 high side , v ol is the other low side voltage, p w2 [w] = (v oh [v] + v ol [v]) x i m [a] (ex.) v oh = 0. 10 [v], v ol = 0.10[v], i m = 200[ma] p w2 [w] = (0. 10 [v] + 0.10[v]) x 200[ma] = 40 .0[mw] (3 ) reference bias current to the lpf and resistors (i ref ) p w3 [w ] = (v cc [v] C v ref [v]) x i ref [a] (ex.) i ref = 6.0[ma] p w3 [w] = (11.3[v] C 3.3[v]) x 6.0[ma] = 48.0[mw] (4 ) fg (al) output sink current (i fg ) p w4 [w] = v fg [v] x i fg [a] (ex.) v fg = 0.10[v], i fg = 5.0[ma] p w4 [w] = 0.10[v] x 5.0[ma] = 0.5[mw] total power consumption of driver ic becomes the following by the above (1 ) to (4 ). p wttl [w] = p w1 [w] + p w2 [w] + p w3 [w] + p w4 [w] (ex.) p wttl [w ] = 50.85[mw] + 40 .0[mw] + 48.0[mw] + 0.5[mw] = 139.35 [m w] refer to next page, when you calculate the chip surface temperatu re (tj) and the package surface temperature (tc) by using the power consumption value. pwm sig i fg i ref i m i cc pwm m h sig to 1k 0.22 to 1 f to 1k to 100k 1k to 100k pwm slope rnf h+ h- out1 ref min ssw tsd control logic osc filter v cc refe- rence pre- driver zper out2 inside reg 13 12 11 10 2 3 4 5 6 7 9 8 fg signal output 1 gnd 14 + - comp figure 55 . current pathway of ic downloaded from: http:///
. 23 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 power dissipation 1. power dissipation power dissipation (total loss) indicates the power that can be cons umed by ic at ta=25 c (normal temperature). ic is heated when it consumes power, and the temperature of ic chip be comes higher than ambient temperature. the temperature that can be accepted by ic chip into the package, that i s junction temperature of the absolute maximum rating, depends on circuit configuration, manufacturing process, e tc . power dissipation is determined by this maximum joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature . therefore, when a power dissipation that provides by the absolu te maximum rating is exceeded, the operating temperature range is not a guarantee. the maximum junction temp erature is in general equal to the maximum value in the storage temperature range. 2. thermal resistance heat generated by consumed power of ic is radiated from the mo ld resin or lead frame of package. the parameter which indicates this heat dissipation capability (hardnes s of heat release) is called thermal resistance. in the s tate of the substrate mounting, thermal resistances from the chip j unction to the ambien ce and to the package surface are shown respectively with ja [ c /w] and jc [ c /w]. thermal resistance is classified into the package part and the substrate part, and thermal resistance in the package part depends on the composition materials such as the mold resins and the lead frames. on the other hand, thermal resis tance in the substrate part depends on the substrate heat dissipation capability of the material, the size, and the c opper foil area etc. therefore, thermal resistance can be decreased by the heat radiation measures like install ing a heat sink etc. in the mounting substrate. the thermal resistance model and calculations are shown in figure 56 . (note)reduce reduce by 7.0mw/c when operating over ta=25c (mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy board) i/o equivalence circuit (resistance values are typical) 1. power supply terminal, 2. pwm input duty 3. hall +/ - input 4. i/o duty slope setting terminal, ground terminal terminal terminal minimum output duty setting terminal, recirculate period setting terminal and soft switching setting terminal 5. reference voltage 6. motor output terminal 1/2, 7. speed pulse signal output terminal output current detecting output terminal resistor connecting terminal ja = (tj C ta) / p [ c /w] jc = (tj C tc) / p [ c /w] figure 56 . thermal resistance model of surface mount figure 57 . power dissipation vs ambient temperature (70.0mm x 70.0mm x 1.6mm glass epoxy substrate) ja = (tj C ta) / p [ c /w] jc = 36 [ c /w] (reference value) v cc gnd ref v cc fg v cc out1 out2 rnf pwm inside reg inside reg 200 k slope ssw min zper 1k h+ h C chip surface temperature tj[c] package surface temperature tc[c] power consumption p[w] ambient temperature t a[c] 0.50 0.75 p d[ w] 0 25 50 75 100 125 150 ta[c] 0.25 0.87 ja=142.9 [c/w] 1 05 downloaded from: http:///
. 24 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitanc e value when using electrolyti c capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the groun d pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver outp uts, dc-dc converter outputs) may inevitably go be low ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the ic and the system t o malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply volta ge, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagneti c field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subjec t the ic to stress. always discharge capacitors completely af ter each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. downloaded from: http:///
. 25 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 operational notes C continued 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. wh en gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 58 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown (tsd) circuit this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be within the ics power dis sipation rating. if however the rating is exceeded for a cont inued period, the junction temperature will rise which will activate the tsd circuit tha t will turn off all output pins. when the junction temperature falls below the tsd threshold, the circuits are automatica lly restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
. 26 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 physical dimension, tape and reel information package name ssop- b1 4 downloaded from: http:///
. 27 /27 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61243FV tsz02201-0h1h0b101290-1-2 jun.19.2015 rev. 001 ordering information marking diagram revision history date revision changes jun.19.2015 001 new release b d 6 1 4 3 f e part number package ? fv ; ssop-b14 v ? g : halogen free packaging and forming specification - 2 2 g ? e2: embossed tape and reel 6 1 2 4 3 ssop-b14 (top view) part number lot number 1pin mark downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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